High-frequency ultrasonic cleaning processing system
Removes particles from as small as 0.1μm! For cleaning semiconductor wafers and more.
This product is a high-frequency ultrasonic cleaning system that removes dust from fine uneven surfaces using ultrasonic waves. It can be used for cleaning semiconductor wafers, masks, and more. We offer a lineup of nozzle injection type, immersion type, and other cleaning processing systems. 【Features】 ■ Removes dust from fine uneven surfaces using ultrasonic waves ■ Equipped with transducers ranging from 400 kHz to 5 MHz ■ Removes particles as small as 0.1 μm ■ Offers a lineup including nozzle injection type and immersion type *For more details, please refer to the PDF document or feel free to contact us.
- Company：光進電気工業 自然計測ディビジョン
- Price：Other
